CGSEAL SI 255 Potting Silicone Compound
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CGSEAL SI 255 Potting Silicone Compound
Description:
CGSEAL SI 255 is a medium-viscosity two-component addition silicone potting compound with medium thermally conductive. It can be applied to the surface of PC, PP, ABS, PVC and other metal substrates.
Features:
- Room temperature or heat accelerated cure
- No substance is released during curing
- Flexible and stable from -40 °C to 200 °C after cured
- Excellent electrical properties with high impedance and high dielectric strength
- Excellent anti-sedimentation design, suitable for long-distance transportation and long-term
| Item | Part A | Part B |
| Uncured | White | Grey |
| Viscosity (cps, 25℃) | 1000～3000 | 1000～3000 |
| Specific Gravity (g/cm3) | 1.20 Approx. | 1.20 Approx. |
| Mixing Ratio by Weight | 1∶1 | |
| Viscosity after Mixing (cps, 25℃) | 1000～30000 | |
| Working Time (min, 25℃) | 20 – 30 | |
| Potting Time (hr, 25℃) | 40-60 | |
| Cured | ||
| Hardness (shore A) | 30-40 | |
| Thermal Conductivity [W/(m·K)] | ≧ 0.6 | ASTM D5470 |
| Dielectric Strength (KV/mm) | ≧ 18 | |
| Dielectric Constant (1.0MHz) | 2.4~3.0 | |
| Volume Resistivity (Ω·cm) | ≧ 1.0×1013 | |
DOWNLOAD TECHNICAL DATA SHEET
APPLICATIONS
Suitable for general potting/encapsulant material of power supplies or other components where thermal release is anticipated.
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